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  4. Ferroelectric hafnium oxide: A CMOS-compatible and highly scalable approach to future ferroelectric memories
 
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2013
Conference Paper
Title

Ferroelectric hafnium oxide: A CMOS-compatible and highly scalable approach to future ferroelectric memories

Abstract
With the ability to engineer ferroelectricity in HfO2 thin films, manufacturable and highly scaled MFM capacitors and MFIS-FETs can be implemented into a CMOS-environment. NVM properties of the resulting devices are discussed and contrasted to existing perovskite based FRAM.
Author(s)
Müller, J.
Böscke, T.S.
Müller, S.
Yurchuk, E.
Polakowski, P.
Paul, J.
Martin, D.
Schenk, T.
Khullar, K.
Kersch, A.
Weinreich, W.
Riedel, S.
Seidel, K.
Kumar, A.
Arruda, T.M.
Kalinin, S.V.
Schlösser, T.
Boschke, R.
Bentum, R. van
Schröder, U.
Mikolajick, T.
Mainwork
IEEE International Electron Devices Meeting, IEDM 2013. Proceedings  
Conference
International Electron Devices Meeting (IEDM) 2013  
DOI
10.1109/IEDM.2013.6724605
Language
English
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
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