Embedded ceramic capacitators in LTCC

The integration of passive elements in ceramic interconnect devices promises higher package densities and reliability. LTCC compatible high-k dielectrics are commercially available with k-values up to 250. Barium titanate dielectrics stand out for their high permittivity even at low sintering temperatures. This fact allows the co-firing with common metallization and commercially available tapes. In this study we investigate the co-firing of barium titanate LTCC tapes with commercially available standard tapes. Pressure assisted sintering and constraint sintering is used for the manufacturing of buried capacitators. Crucial parameters are worked out using a statistical setup according to Taguchi. High k-values up to 2300 are obtained for embedded dielectric tape patches. Beside of the capac itator properties the process constancy is observed.