Establishing the critical fracture properties of the die backside-to-molding compound interface

This paper presents essential improvements to determining interfacial fracture properties of the silicon die-to-molding compound interface. The improvements affect specimen fabrication in two different molding technologies and experimental methods using the mixed mode chisel (MMC) setup. We show how to overcome pre-test fracture of the delamination specimens, how to extend the previously aimed fracture mode mix range, how to reduce the number of experiments necessary and extrapolation methods in order to apply the interface data in failure models.