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  4. Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding
 
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2011
Conference Paper
Title

Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding

Abstract
This paper presents a novel post-process gap reduction technology of high aspect ratio microstructures. The gap reduction procedure uses the well known electrostatic deflection of a movable microstructure. In contrast to other solutions, micro welding is utilized to create the final, permanent locking. The fabrication technology, the functional principle of the gap reduction mechanism and the experimental set-up is presented. As a result the initial gap width between vertical comb electrodes was decreased from 4500 nm to 385 nm, leading to a final aspect ratio of 150.
Author(s)
Nowack, M.
Leidich, S.
Reuter, Danny  
Kurth, Steffen  
Kuchler, M.
Bertz, Andreas  
Geßner, Thomas  
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Mainwork
16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2011  
Conference
International Solid-State Sensors, Actuators and Microsystems Conference 2011  
DOI
10.1109/TRANSDUCERS.2011.5969505
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
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