• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Integration of a multifunctional and multispectral optical sensor for automotive applications using surface mountable planar optical interconnect
 
  • Details
  • Full
Options
2010
Conference Paper
Title

Integration of a multifunctional and multispectral optical sensor for automotive applications using surface mountable planar optical interconnect

Abstract
In this paper we present the design and fabrication of a low cost surface mountable planar optical interconnect and the integration in a low-cost multifunctional and mUltispectral CMOS vision sensor (MFOS) to detect critical environmental parameters (fog, rain, twilight) providing, at the same time, information on the driving scenario (oncoming vehicles, VRUs in night conditions). The project ADOSE addresses research challenges in the area of accident prevention; the focus is on functional, performance and cost limits of current sensors and Advanced Driver Assistance Systems for their extensive market penetration. The 3D structure of the interconnect makes it possible to guide collimated light to dedicated detection regions on a CMOS imager, thus making a virtual partition of the sensitive imager area in sub-areas, usually not needed by the applications requiring the frontal view monitoring, possible. Therefore one imager chip can be used for several sensing and imaging functions. The optical system can be passively assembled and is surface mountable resulting in low cost fabrication.
Author(s)
Klein, A.
Gerritzen, A.
Schröder, H.
Oppermann, H.
Capello, D.
Pallaro, N.
Mainwork
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2  
Conference
Electronics System Integration Technology Conference (ESTC) 2010  
DOI
10.1109/ESTC.2010.5642958
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024