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  4. Packaging for radiation resistant X-ray detectors
 
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2010
Conference Paper
Title

Packaging for radiation resistant X-ray detectors

Abstract
Today non-destructive evaluation techniques become more and more important. Consequently, X-ray detectors are suitable tools to get information about specimens. In comparison to the already established scintillation principle, the direct converting method on the basis of semiconductor materials delivers several advantages. Hence, it is necessary to speed this measurement method and develop appropriate packages for these assemblies. In this paper the method of direct converting X-ray line detectors as well as their packaging and relevant aspects are introduced.
Author(s)
Lohse, T.
Oppermann, M.
Metasch, R.
Zerna, T.
Seilmayer, M.
Wolter, K.
Mainwork
33rd International Spring Seminar on Electronics Technology, ISSE 2010: Polymer Electronics and Nanotechnologies: Towards System Integration  
Conference
International Spring Seminar on Electronics Technology (ISSE) 2010  
DOI
10.1109/ISSE.2010.5547276
Language
English
Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP  
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