Multiobjective optimization for decision support in automated 2.5D system-in-package electronics design

We propose a multiobjective optimization approach for decision support in the 2.5D System-in-Package (SiP) design automation. 2.5D SiP is a relatively new integration concept for miniaturization in which a microelectronic system is integrated on vertically stacked substrate modules. We approach the SiP layout process with Pareto optimization. A database of optimized SiP layouts is interactively explored with our decision support tool 3D SiP Expert. Our optimization methods streamline the layout process, eliminate time-consuming redesign steps and support selecting SiP technologies and the ideal number of substrate modules. We discuss a constructive heuristic that places the devices on the substrates. Our computational results show that the heuristic is efficient and finds solutions within 6% of optimality. We also propose group constraints that implicitly cluster device groups, e.g., functional cooperating devices, and that structure the placement.