Design methods for 3D IC integration

Modern 3D integration technologies are a promising way to realize existing systems with higher performance, smaller dimension, and at lower costs. Furthermore, completely new system concepts become possible. But, there are also doubts about advantages of 3D for a particular application, about reliability, and about the cost benefits. A lot of work is carried out to advance the manufacturing technologies for through silicon vias (TSV) as well as for stacking and assembly. To bridge the gap between high end manufacturing technologies and application requirements powerful design methods are needed. Since understanding of basic mechanisms and effects is a first step to change things, modeling and simulation, and optimization are very important design methods for 3D. To handle the complexity within the 3D system a hierarchical modular approach for multi physics simulation must be applied. Based on the information gained from simulation but also from measurements the influence of 3D technologies on the system behavior can be quantified and used as an input for other design methods. In this paper basic design aspects for 3D are described. Based on a modular modeling approach the investigation of several design issues is discussed. Finally, the authors reflect on important design methods and future challenges and their relation to model-based design approaches.