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  4. Impact of lithography variations on advanced CMOS devices
 
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2009
Conference Paper
Title

Impact of lithography variations on advanced CMOS devices

Abstract
Source and relevance of process variations are briefly discussed. A combination of own lithography and commercial TCAD simulation software is applied to assess the impact of some of the most relevant variations occurring in lithography on the electrical properties of three kinds of CMOS devices with 32 nm physical gate length.
Author(s)
Lorenz, J.  
Kampen, C.
Burenkov, A.  
Fühner, T.
Mainwork
VLSI-TSA 2009, International Symposium on VLSI Technology, Systems, and Applications  
Conference
International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) 2009  
DOI
10.1109/VTSA.2009.5159272
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • process variation

  • lithography simulation

  • process simulation

  • CMOS devices

  • variation-tolerant process flow

  • device architecture

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