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  4. Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
 
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2008
Conference Paper
Title

Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers

Author(s)
Wächtler, T.
Oswald, S.
Pohlers, A.
Schulze, S.
Schulz, S.E.
Gessner, T.
Mainwork
Advanced Metallization Conference, AMC 2007  
Conference
Advanced Metallization Conference (AMC) 2007  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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