2008
Conference Paper
Title

Experimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography

Title Supplement
Abstract
Author(s)
Schacht, R.
May, D.
Kreyßig, K.
Wittler, O.
Wunderle, B.
Michel, B.
Mainwork
Conference
Language
English