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  4. Characterization of the Segregation of Arsenic at the Interface SiO2/Si
 
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2007
Conference Paper
Title

Characterization of the Segregation of Arsenic at the Interface SiO2/Si

Other Title
Charakterisierung der Segregation von Arsen an der Grenzschicht SiO2/Si
Abstract
The segregation of As atoms at the Si/SiO2 interface during annealing was investigated by grazing incidence X-ray fluorescence spectroscopy in combination with successive removal of silicon layers by etching with thicknesses on the order of a nanometer. With this method it is possible to clearly distinguish between the segregated atoms and the As atoms in the bulk over a large range of implantation doses from 3E12 cm-2 to 1E16 cm-2. The samples were annealed at 900 °C and 100 0 °C, respectively, for times sufficiently long to ensure that the segregation reflects an equilibrium effect. The results were confirmed by medium energy ion scattering, Z-contrast measurements and electron energy loss spectroscopy.
Author(s)
Steen, C.
Pichler, P.  orcid-logo
Ryssel, H.
Pei, L.
Duscher, G.
Werner, M.
Berg, J.A. van den
Windl, W.
Mainwork
Semiconductor Defect Engineering-Materials, Synthetic Structures and Devices II  
Conference
Symposium F "Semiconductor Defect Engineering-Materials, Synthetic Structures, and Devices" 2007  
Materials Research Society (Spring Meeting) 2007  
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • arsenic

  • interface

  • silicon

  • characterization

  • txrf

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