Parametric approach to numerical design for optimization of stacked packages

The main aim for development of smaller packages is mainly due to ongoing development of portable communications devices. Thin silicon die improves device performance and reliability. Novel technological processes allow for the thinning of wafers to 2 mils without residual damage to the backside silicon or topside circuitry. Stacked packages reduce packaging cost and cycle-times. Wafers are stacked to form 3D multi-chip packages. On the other hand the electronic market requires novel and efficient designing tools as numerical design for optimization. The goal of the work was to design a reliable numerical model of the stacked package and afterwards perform numerical design for optimization in reference to a number of variables, which influence the package reliability. The numerical model of the analyzed stacked package was elaborated in ABAQUS with an embedded Python script language. The design for optimization was done by two alternative approaches: direct and indirect design for optimization. The direct approach was based on genetic algorithms while indirect approach was achieved by combination of design of experiments (DOE) with response surface modeling (RSM) methods.