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  4. Analytical and mechanical methods for material property investigations of SnAgCu-solder
 
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2006
Conference Paper
Title

Analytical and mechanical methods for material property investigations of SnAgCu-solder

Abstract
The development of lead-free solder materials with improved reliability properties requires a detailed understanding of the relationship between mechanical properties and microstructure. The paper presents methods that can be applied to characterize creep and plastic deformation behaviour and shows how currently available analytical methods for microstructure investigations can be used to track the physical origin of the observed mechanical behaviour. The paper will specifically describe advantages and use of mechanical and analytical tools, like nanoindentation, FIB, SEM, TEM and EDX in the field of solders for interconnects in electronic packaging.
Author(s)
Petzold, M.
Bennemann, S.
Graff, A.
Krause, M.
Müller, M.
Wiese, S.
Wolter, K.-J.
Mainwork
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.1  
Conference
Electronics Systemintegration Technology Conference (ESTC) 2006  
DOI
10.1109/ESTC.2006.280029
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
Keyword(s)
  • lead-free solder material

  • mechanical property

  • indentation testing

  • microstructure analysis

  • nanoparticle

  • TEM

  • dislocation

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