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  4. Mesoscopic resist processing simulation in optical lithography
 
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2006
Conference Paper
Title

Mesoscopic resist processing simulation in optical lithography

Abstract
Line-edge roughness (LER) control and minimization are among the critical issues for the further advancements in EUV and optical lithography. For the simulation of LER, discrete and stochastic models are required. This paper presents an improved stochastic exposure simulation model. It is proven that it is not necessar y to take the Poisson distribution of the photon statistics into account. Mesoscopic exposure and post exposure bake models are compared with continuous, deterministic models in terms of obtained CD values, convergence behavior, and required computing time. The results obtained with both methods show a very good agreement.
Author(s)
Schnattinger, T.
Bär, E.  orcid-logo
Erdmann, A.  
Mainwork
International Conference on Simulation of Semiconductor Processes and Devices. SISPAD 2006. Proceedings  
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2006  
DOI
10.1109/SISPAD.2006.282905
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • resist processing

  • lithography simulation

  • mesoscopic modeling

  • line-edge roughness

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