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  4. Thin Wafer Stacking for Infrared Sensor Applications
 
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2005
Conference Paper
Title

Thin Wafer Stacking for Infrared Sensor Applications

Author(s)
Scherbaum, S.
Simon, T.
Ziegler, J.
Bock, K.
Mainwork
International Workshop on Thin Semiconductor Devices. Proceedings. CD-ROM  
Conference
International Workshop on Thin Semiconductor Devices 2005  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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