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New Interconnection Technologies for the Integration of Electronics on Textile Substrates
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2005
Conference Paper
Titel
New Interconnection Technologies for the Integration of Electronics on Textile Substrates
Author(s)
Linz, Torsten
Kallmayer, C.
Hauptwerk
Ambience 05, International Scientific Conference, Intelligent Ambience and Well-Being. Proceedings
Konferenz
International Scientific Conference Ambience 2005
DOI
10.24406/publica-fhg-350372
File(s)
003.pdf (1.95 MB)
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM