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  4. Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes
 
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2005
  • Konferenzbeitrag

Titel

Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes

Titel Supplements
Abstract
Author(s)
Schreier-Alt, T.
Sehnert, J.
Rebholz, C.
Michel, B.
Ansorge, F.
Hauptwerk
MicroCar 2005. Micro materials, nano materials for automotives. Volume of Abstracts
Konferenz
Fachkongress MicroCar 2005
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Language
Englisch
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