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Thermo-mechanical reliability analysis on solder joints of ceramic components
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2005
Conference Paper
Title
Thermo-mechanical reliability analysis on solder joints of ceramic components
Author(s)
Dudek, R.
Döring, R.
Michel, B.
Picault, A.
Autissier, J.-F.
Mainwork
IPC / Soldertec Global 3rd International Conference on Lead-Free Electronics 2005. Towards implementation of the RoHs directive. CD-ROM
Conference
International Conference on Lead-Free Electronics 2005
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
