• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Electrical deactivation and diffusion of boron in preamorphized ultrashallow junctions: Interstitial transport and F co-implant control
 
  • Details
  • Full
Options
2004
Conference Paper
Title

Electrical deactivation and diffusion of boron in preamorphized ultrashallow junctions: Interstitial transport and F co-implant control

Other Title
Elektrische Deaktivierung und Diffusion von Bor in voramorphisierten ultraflachen p/n-Übergängen: Transport von Eigenzwischengitteratomen und die Steuerung über eine Koimplantation von Fluor
Abstract
This work presents breakthrough results on the physics and modeling of deactivation and transient enhanced diffusion of boron in preamorphized (PAI) ultrashallow junctions, and the mechanisms by which fluorine co-implantation controls these processes. The results providea much-needed general physical framework for the evaluation of novel equipment and thermal processes beyond the 50 nm technology node.
Author(s)
Colombeau, B.
Smith, A.J.
Cowern, N.E.B.
Lerch, W.
Paul, S.
Pawlak, B.J.
Cristiano, F.
Hebras, X.
Bolze, D.
Ortiz, C.
Pichler, P.  orcid-logo
Mainwork
IEDM 2004, International Electron Devices Meeting. Technical Digest  
Conference
International Electron Devices Meeting (IEDM) 2004  
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • boron

  • silicon

  • diffusion

  • activation

  • simulation

  • modeling

  • fluorine

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024