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  4. 3D simulation of process effects limiting FinFET performance and scalability
 
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2004
Conference Paper
Title

3D simulation of process effects limiting FinFET performance and scalability

Other Title
3D-Simulation von prozessierungsrelevanten Effekten, welche die Leistungsfähigkeit und Miniaturisierung von FinFETs beschränken
Abstract
Coupled three-dimensional process and device simulations have been applied to study effects limiting the performance of FinFETs, a novel CMOS transistors suggested to overcome the limitations of conventional CMOS for gate lengths at 50 nm and below.
Author(s)
Burenkov, A.  
Lorenz, J.  
Mainwork
Simulation of Semiconductor Processes and Devices 2004  
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2004  
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • process simulation

  • device simulation

  • device performance

  • device scalability

  • spread of process result

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