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Bonding and contacting of MEMS-structures on wafer level
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2003
Conference Paper
Title
Bonding and contacting of MEMS-structures on wafer level
Author(s)
Wiemer, M.
Frömel, J.
Jia, C.
Gessner, T.
Mainwork
Semiconductor wafer bonding VII: Science, technology, and applications
Conference
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications 2003
Electrochemical Society (Spring Meeting) 2003
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
