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3D system integration technologies
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2003
Conference Paper
Title
3D system integration technologies
Author(s)
Ramm, P.
Klumpp, A.
Merkel, R.
Weber, J.
Wieland, R.
Ostmann, A.
Wolf, J.
Mainwork
Materials, technology and reliability for advanced interconnects and low-k dielectrics
Conference
Symposium E: "Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics" 2003
Materials Research Society (Spring Meeting) 2003
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM