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Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
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2001
Conference Paper
Titel
Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
Author(s)
Petzold, M.
Knoll, H.
Bagdahn, J.
Hauptwerk
Reliability, Testing, and Characterization of MEMS and MOEMS Conference
Konferenz
Reliability, Testing, and Characterization of MEMS and MOEMS Conference 2001
DOI
10.1117/12.442994
Language
English
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Fraunhofer-Institut für Werkstoffmechanik IWM