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New dimension in radioscopic quality inspection for microelectronics and packaging
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2001
Conference Paper
Title
New dimension in radioscopic quality inspection for microelectronics and packaging
Author(s)
Baumbach, T.
Helfen, L.
Hanke, R.
Mainwork
Micro System Technologies 2001
Conference
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components 2001
Language
English
Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP
