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  4. Large area patterning of high-density interconnects by novel UV-excimer lithography and photo patternable ORMOCERTM-dielectrica
 
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2001
Conference Paper
Title

Large area patterning of high-density interconnects by novel UV-excimer lithography and photo patternable ORMOCERTM-dielectrica

Author(s)
Robertsson, M.
Haglund, J.
Johansson, C.
Gibaud, P.
Lambert, D.
Popall, M.
Fröhlich, L.
Tolvgard, A.
Alping, A.
Linden, L.
Rodekirch, J.
Zemel, M.I.
Nunes, C.C.
Mainwork
13th European Microelectronics and Packaging Conference & Exhibition 2001. Conference proceedings. CD-ROM  
Conference
European Microelectronic and Packaging Conference & Exhibition (EMPC) 2001  
Language
English
Fraunhofer-Institut für Silicatforschung ISC  
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