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Processing of tungsten- and molybdenum-copper housings for microelectronic packaging via metal injection moulding (MIM)
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2000
Conference Paper
Titel
Processing of tungsten- and molybdenum-copper housings for microelectronic packaging via metal injection moulding (MIM)
Author(s)
Knüwer, M.
Wichmann, K.-H.
Meinhardt, M.
Hauptwerk
2nd European Symposium on Powder Injection Moulding 2000
Konferenz
European Symposium on Powder Injection Moulding (PIM) 2000
Language
English
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Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM