English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Processing of tungsten- and molybdenum-copper housings for microelectronic packaging via metal injection moulding (MIM)
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2000
Conference Paper
Title
Processing of tungsten- and molybdenum-copper housings for microelectronic packaging via metal injection moulding (MIM)
Author(s)
Knüwer, M.
Wichmann, K.-H.
Meinhardt, M.
Mainwork
2nd European Symposium on Powder Injection Moulding 2000
Conference
European Symposium on Powder Injection Moulding (PIM) 2000
Language
English
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
