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3D simulation of the conformality of copper layers deposited by low-pressure chemical vapor deposition from cul(tmvs)(hfac)
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2000
Conference Paper
Title
3D simulation of the conformality of copper layers deposited by low-pressure chemical vapor deposition from cul(tmvs)(hfac)
Author(s)
Bär, E.
Lorenz, J.
Ryssel, H.
Mainwork
Materials for advanced metallization. Proceedings of the Third European Workshop on Materials for Advanced Metallization
Conference
European Workshop on Materials for Advanced Metallization (MAM) 1999
Language
English
IIS-B
