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  4. A computationally efficient method for three-dimensional simulation of ion implantation
 
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1999
Conference Paper
Title

A computationally efficient method for three-dimensional simulation of ion implantation

Other Title
Eine rechenzeiteffiziente Methode für die dreidimensionale Simulation
Abstract
A new method for an accurate and CPU time efficient three-dimensional simulation of ion implantation is suggested in this work. The method is based on a combination of the algorithmic capabilities of the analytical and Monte-Carlo simulation methods. The Monte-Carlo method was used to generate a three-dimensional point response distribution function for the given implantation conditions. Using the numerically generated point response and an efficient algorithm for 3D convolution a point response based interface between the Monte-Carlo and analytical simulation methods was established. The combined simulation approach is able to accurately account for the channeling effect which is especially strong in case of a normal implantation into crystalline silicon. The combined simulation approach was implemented in the software for three-dimensional simulation of ion implantation and showed a reduction of the simulation time by a factor 10 and more compared to full scale Monte-Carlo simulation without sacrificing the simulation accuracy.
Author(s)
Burenkov, A.  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Tietzel, K.
Hössinger, A.
Lorenz, J.  
Ryssel, H.
Selberherr, S.
Mainwork
SISPAD '99. Proceedings  
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 1999  
DOI
10.1109/SISPAD.1999.799258
Language
English
IIS-B  
Keyword(s)
  • 3D process simulation

  • ion implantation

  • Monte Carlo

  • point response

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