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Coupled 3D process and device simulation of advanced MOSFETs
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1998
Conference Paper
Title
Coupled 3D process and device simulation of advanced MOSFETs
Author(s)
Tietzel, K.
Burenkov, A.
Fraunhofer-Institut für Integrierte Schaltungen IIS
Lorenz, J.
Mainwork
SISPAD 98. Simulation of semiconductor processes and devices
Conference
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 1998
Language
English
IIS-B
