1997
Conference Paper
Title

Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

Author(s)
Becker, K.-F.
Ansorge, F.
Ehrlich, R.
Azdasht, G.
Bader, V.
Aschenbrenner, R.
Reichl, H.
Mainwork
Conference
Language
English