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Konferenzschrift
Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology
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1997
Konferenzbeitrag
Titel
Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology
Author(s)
Ansorge, F.
Becker, K.-F.
Azdasht, G.
Ehrlich, R.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
Third International Assembly and Packaging Foundry Conference 1997. Proceedings
Konferenz
International Assembly and Packaging Foundry Conference (APCON) <3, 1997, Sunnyvale/Calif)
Language
Englisch
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