Full-duplex transceiver-PIC fabricated by using three MOVPE growth steps

Summary form only given. For future photonic communications systems low-cost optoelectronic-integrated circuits are indispensable. These photonic ICs should have an ultrahigh capacity and should offer a maximum of flexibility in device architecture. High performance and high reliability are a must for the economic implementation. Based on our experiences in the fabrication of a polarization diversity heterodyne receiver we present here an improved, cost-effective, and versatile integration PIC process with reduced epitaxial growth steps.