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  4. Three-dimensional simulation of ion implantation
 
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1996
Conference Paper
Title

Three-dimensional simulation of ion implantation

Other Title
Dreidimensionale Simulation der Ionenimplantation
Abstract
With shrinking dimensions and growing complexity of advanced ULSI devices three-dimensional effects are becoming more and more important for their development and optimization. For this reason, within the project PROMPT a multidimensional process simulation software capable to provide appropriate input to three-dimensional device simulation has been developed by a European consortium. The PROMPT software compiles the geometry and the dopant profiles of the device from the results of existing one- and two-dimensional process simulators and three-dimensional modules newly developed. Within this presentation, the capabilities of the three-dimensional ion implantation module developed at FhG-IIS-B within PROMPT are being outlined.
Author(s)
Tietzel, K.
Burenkov, A.  
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Lorenz, J.  
Ryssel, H.
Mainwork
Software for electrical engineering analysis and design  
Conference
International Conference on Software for Electrical Engineering Analysis and Design 1996  
Electrosoft 1996  
Language
English
IIS-B  
Keyword(s)
  • analytical method

  • analytische Methode

  • Halbleitertechnologie

  • ion implantation

  • Ionenimplantation

  • process simulation

  • Prozeßsimulation

  • semiconductor technology

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