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Experimental and numerical deformation analysis on components of microsystem technology
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1994
Conference Paper
Title
Experimental and numerical deformation analysis on components of microsystem technology
Author(s)
Michel, B.
Kühnert, R.
Auersperg, J.
Tränkner, K.
Mainwork
EuPac '94. Vorträge und Posterbeiträge der 1. Europäischen Konferenz für Elektronische Packaging-Technologie und des 7. Internationalen Kolloquiums "Verbindungstechnik in der Elektronik"
Conference
European Conference on Electronic Packaging Technology (EuPac) 1994
International Conference on Interconnection Technology in Electronics 1994
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
