• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Der Wärmeübergang von Mikrostrukturen durch freie Konvektion
 
  • Details
  • Full
Options
1991
Conference Paper
Title

Der Wärmeübergang von Mikrostrukturen durch freie Konvektion

Other Title
Convective heat transport from microstructures
Abstract
For the design of microstructures (Sensors, Actuators ...) thermal modelling is very important. The heat flow from a microstructure to its surrounding is calculated. The main mechanisms are heat conduction and wall heat transfer. While the simulation of thermal conduction is straight-forward, the heat transfer coefficients of microstructures are not very well known. In this paper calculations on heat transfer from micromechanic diaphragms are presented. The calculations are compared to experiments done with processed structures. Three situations are considered: Influence of temperature, influence of geometry, influence of a heat sink.
Author(s)
Kühl, K.
Lang, W.
Mainwork
Sensor '91. Proceedings. Bd.II  
Conference
Sensor 1991  
Language
German
IFT  
Keyword(s)
  • chip

  • Wärmeübergang

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024