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  4. Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat
 
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Patent
Title

Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat

Abstract
WO15082179A1 [EN] The invention relates to a method for forming an electrically conductive structure on a plastic substrate, wherein an ink, which contains electrically conductive solid particles, is printed on the plastic substrate, wherein copper particles are used as electrically conductive solid particles and, after the printing of the ink, only the surface regions of the plastic substrate on which the electrically conductive structure is to be formed are swept over by means of an electron beam having a first energy per unit length within a vacuum chamber, which first energy per unit length causes sintering of the copper particles.
Inventor(s)
Fahland, Matthias  
Graffel, Benjamin
Mattausch, Gösta  
Winckler, Falk  
Weiss, Stefan  
Mosch, Sindy  
Jurk, Robert
Link to:
Espacenet
Patent Number
102013113485
Publication Date
2015
Language
German
Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP  
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