Stationsanordnung zur Bearbeitung und/oder Vermessen von Halbleiterscheiben sowie Bearbeitungsverfahren

The arrangement has a loading module (130), a processing station (120) for processing semiconductor disks (000) and/or a measuring station (140) for measuring a variable of the semiconductor disks. A transport robot (101) is arranged in a transporting housing (100) as individual modules. The transport robot allows transport of the semiconductor disks to be processed between the loading module and the respective processing station in order to process the semiconductor disks, and/or the measuring station in order to measure the semiconductor disks. An independent claim is also included for a method for processing semiconductor wafers.