Aufreinigung eines Tiegels für eine Halbleiterverarbeitung

Cleaning a crucible (12) for processing semiconductor materials, comprises (a) filling (14) the contaminated crucible with a semiconductor material (16), (b) melting the semiconductor material in the contaminated crucible such that impurities (18) from the contaminated crucible are included by the semiconductor material (16'), and (c) removing the semiconductor material with the included-impurities. An independent claim is also included for manufacturing the crucible, comprising carrying out primary forming of the crucible, and carrying out the above mentioned method.