Verfahren zum dauerhaften Verbinden zweier Komponenten durch Loeten mit Glas- oder Metalllot

(A1) Beschrieben wird ein Verfahren zum dauerhaften Verbindung zweier Komponenten durch Loeten unter Verwendung eines Glas- oder Metalllotes als Lotmaterial, bei dem auf beide Komponenten jeweils ein eine Haftung vermittelndes Schichtsystem aufgebracht wird, zwischen denen das Lotmaterial eingebracht wird, das auf eine fuer das Lotmaterial charakteristische Lottemperatur erwaermt wird und nach Erkanlten zu einer dauerhaften Lotverbindung zwichen beiden Komponenten fuehrt. Die Erfindung zeichnet sich dadurch aus, dass das die Haftung vermittelnde Schichtsystem eine unmittelbar auf die Komponente aufbringbare Haftvermittlerschicht sowie eine loetfaehige Schicht aufweist, bei dem die Haftvermittlerschicht oxidische, karbidische, nitridische Komponenten oder Mischverbindungen hieraus enthaelt.

DE 102007029031 A1 UPAB: 20090114 NOVELTY - The method for permanently connecting two components (4, 6) by soldering using a glass or metal solders as solder material (5), comprises introducing a layer system (7) mediating an adhesion on one of the components and then guiding to a permanent solder joint between the components after cooling. One of the components consists of an electrically non-conductive material. The solder material is applied on the layer system, is directly or indirectly contacted with the other component, and is heated at a soldering temperature for the solder material characteristic. DETAILED DESCRIPTION - The method for permanently connecting two components (4, 6) by soldering using a glass or metal solders as solder material (5), comprises introducing a layer system (7) mediating an adhesion on one of the components and then guiding to a permanent solder joint between the components after cooling. One of the components consists of an electrically non-conductive material. The solder material is applied on the layer system, is directly or indirectly contacted with the other component, and is heated at a soldering temperature for the solder material characteristic. The layer system has an adhesion mediator layer (1) and a solderable layer (2) indirectly bringable on the component. The adhesion mediator layer is oxidic-, carbidic- and nitric compounds or alloys. A metal compound is used as the adhesion mediator layer, and distinguishes itself by the chemical composition of Me(CaNbOcSdXe), where Me represents a metal or a metal compound, one of the counting indices of a, b, c, d and e is not equal to zero, C is carbon, N is nitrogen, O is oxygen, S is sulfur and X represents fluorine, chlorine and bromine. The adhesion mediator layer has heteroatoms from the halides. The adhesion mediator layer contains one of the metallic elements from the following main- or sub group of the periodic system consisting of lanthanides and groups of III, IV, V, VI, VII, VIII, XIII and XIV. The adhesion mediator layer has a layer thickness, along which the material composition of the adhesion mediator layer is varied, in which one of the counting indices of a, b, c, d, e is varied. The solderable layer is directly applied on the adhesion mediator layer. The layer system provides a layer, which is applied on the solderable layer. The layer system is formed with a thickness of 20 nm. The layer system is produced in the way of a chemical vapor deposition (CVD) process, physical vapor deposition (PVD) process, sputtering process or metal epitaxy process and a wet-chemical process or in the way of a galvanic separation process. The heating of the solder material takes place by local heating of the solder material or by collective heating of the layer system including the components to be connected with one another. One of the components consists of a glass material, with which a second component is connected. A layer material is selected as solderable layer. USE - Method for permanently connecting two components, which are useful in the field of optics and metrology. ADVANTAGE - The method ensures rapid and effective connection of the two components with inexpensive material without external environment influences such as electro magnetic radiation, moisture and temperature in improved manner.