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  4. Klebstoffzusammensetzung fuer Klebeverbindungen, die mittels Anlegen von elektrischer Spannung geloest werden koennen
 
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Patent
Title

Klebstoffzusammensetzung fuer Klebeverbindungen, die mittels Anlegen von elektrischer Spannung geloest werden koennen

Other Title
Adhesive composition, useful for splicing tape, comprises a matrix from a reaction resin and/or fusion adhesive polymer; a mobile polymer electrolytic component and a stable salt with halogenated anion
Abstract
Die Erfindung betrifft eine Klebstoffzusammensetzung fuer mittels Anlegens einer elektrischen Spannung loesbare Klebeverbindungen, die eine Matrix aus einem Reaktionsharz und/oder einem Schmelzklebstoffpolymer, eine in der Matrix bewegliche polymere Elektrolytkomponente und ein bis 200<C stabiles Salz mit einem halogenhaltigen Anion enthaelt.

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DE 102005050632 A1 UPAB: 20070703 NOVELTY - Adhesive composition (I) for solvable splicing tape comprises: a matrix from a reaction resin and/or a fusion adhesive polymer; a mobile polymer electrolyte component; and a stable salt with halogenated anion (at 200degreesC). DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a component with adhesive binding obtained by the adhesive composition. USE - (I) is useful for solvable splicing tape and safety adhesive tape (claimed). (I) is also useful as a fusion adhesive. ADVANTAGE - (I) is an improved composition for adhesive compounds and can be loosened or removed selectively, at high temperatures, and is re-usable completely within short time. (I) exhibits improved adhesive strength.
Inventor(s)
Kolbe, J.
Stuve, M.
Born, E.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=102005050632A
Patent Number
102005050632
Publication Date
2007
Language
German
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM  
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