Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat

Bei einem Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat, und insbesondere zum Herstellen von RFID-Label, werden zunaechst das leitfaehige Grundmaterial und das Substratmaterial bereitgestellt, ferner wird das leitfaehige Grundmaterial gestanzt, um eine Leiterstruktur und ein Restgrundmaterial zu erhalten. Die Leiterstruktur wird mit dem Substratmaterial verbunden und das Restgrundmaterial entfernt.

DE 102005016511 A1 UPAB: 20061218 NOVELTY - The method involves providing a conductive base material (10), and a substrate material (14). The material (10) is stamped by a rolling die to obtain a structured conductive base material having a conductor structure (30) and a remaining base material. The structured (30) and the remaining materials are completely separated by the stamping. The structure (30) is connected with the material (14), and the remaining material is removed. USE - Used for producing a conductor structure e.g. antenna structure, on a substrate for a radio frequency identification (RFID) label for a radio frequency identification (RFID) system. Can also be utilized for an identification system e.g. wireless identification system such as bar code system, optical character recognition (OCR) system, for person identification, animal identification, brand and/or product protection, logistic, immobilizer and locking system. ADVANTAGE - The base material is stamped by the rolling die to obtain the structured conductive base material, which has the conductor structure and the remaining base material, thus enabling a continuous and fast working process with high throughput, and hence reducing the cost and the machine invest for manufacturing the conductor structure with high accuracy.