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Patent
Title

Verfahren zur Herstellung elektrisch leitender Verbindungen

Other Title
Production of electrically conducting compounds comprises distributing a particulate filler in a polymer matrix, and forming material bridges between the filler particles and the electrically conducting surfaces to be joined.
Abstract
Es wird ein Verfahren elektrisch leitender Verbindungen, mit einem Leitkleber, bei dem elektrisch leitfaehige metallische und/oder nichtmetallische Fuellstoffkomponenten in einer Polymermatrix sind, beschrieben. Das Verfahren ist dadurch gekennzeichnet, dass die partikelfoermigen Fuellstoffe mit einem Masseanteil von mindestens 55% in hochdisperser Form in der Polymermatrix verteilt sind und durch Fuegen von miteinander elektrisch leitend zu verbindender Teile infolge der Diffusionsneigung der partikelfoermigen Fuellstoffe stoffliche Bruecken zwischen den einzelnen Fuellstoffpartikeln und den elektrisch leitend zu verbindenden Oberflaechen ausgebildet werden.

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DE 10000834 A UPAB: 20020502 NOVELTY - Production of electrically conducting compounds comprises distributing a particulate filler in an amount of 55 wt.% in highly dispersed form in a polymer matrix, and forming material bridges between the filler particles and the electrically conducting surfaces to be joined by joining the electrically conducting parts as a result of diffusion of the particulate filler. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a conducting filler used in the process comprising electrically conducting metallic and/or non-metallic particulate fillers distributed in a polymer matrix, the particles having a maximum grain size of 100 mu m. Preferred Features: The particulate filler contains gold, silver, platinum, nickel, palladium or copper or is in the form of metal-coated glass and/or plastic. Cyclic carboxylic anhydrides are worked into the polymer matrix. USE - Used in the production of electronic components, especially liquid crystal cells. ADVANTAGE - The compounds retain their electrical conductivity and have good processability.
Inventor(s)
Born, E.
Schaefer, H.
Guenther, B.
Scheel, W.
Wittke, K.
Nowottnick, M.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=10000834A
Patent Number
2000-10000834
Publication Date
2001
Language
German
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM  
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