Verfahren und Vorrichtung zur plasmachemischen Reinigung von Substraten

The invention relates to a device and a process for the plasma-chemical cleaning of substrates by means of a low-temperature low-pressure plasma, by which water or an aqueous gas mixture is used as the plasma gas. This permits the removal of the various impurities from a wide variety of substrate materials. For example, metals, semiconductor products, organic and unorganic polymers and non-metallic unorganic materials can be cleaned. Moreover, impurities such as oils, greases, plastic residue, burnt-in, resinified oils, oxides, grinding and polishing agents can be removed.