Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits

2019

Buch

Author(s)

Franzon, Paul D.

North Carolina State University

Marinissen, Erik Jan

IMEC

Bakir, Muhannad S.

Georgia Institute of Technology

Garrou, Philip

Microelectronics Consultants of NC

Koyanagi, Mitsumasa

Tohoku University

Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT

Verlag

Verlagsort

Weinheim