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  4. Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology
 
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2022
Journal Article
Title

Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology

Abstract
The wide bandgap of silicon carbide (SiC) has attracted a large interest over the past years in many research fields, such as power electronics, high operation temperature circuits, harsh environmental sensing, and more. To facilitate research on complex integrated SiC circuits, ensure reproducibility, and cut down cost, the availability of a low-voltage SiC technology for integrated circuits is of paramount importance. Here, we report on a scalable and open state-of-the-art SiC CMOS technology that addresses this need. An overview of technology parameters, including MOSFET threshold voltage, subthreshold slope, slope factor, and process transconductance, is reported. Conventional integrated digital and analog circuits, ranging from inverters to a 2-bit analog-to-digital converter, are reported. First yield predictions for both analog and digital circuits show great potential for increasing the amount of integrated devices in future applications.
Author(s)
Romijn, J.
Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
Vollebregt, S.
Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
Middelburg, L.M.
Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
El Mansouri, B.
Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
Zeijl, H.W. van
Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
May, Alexander  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Erlbacher, Tobias  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Zhang, G.
Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
Sarro, P.M.
Laboratory of Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
Journal
IEEE transactions on electron devices  
Open Access
DOI
10.1109/TED.2021.3125279
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • 4H-SiC

  • CMOS technology

  • integrated SiC electronics

  • logic gates

  • semiconductor device measurement

  • silicon carbide

  • silicon carbide CMOS

  • substrates

  • temperature measurement

  • threshold voltage

  • wide bandgap

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