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  4. FoilMet®-Interconnect: Busbarless, electrically conductive adhesive-free, and solder-free aluminum interconnection for modules with shingled solar cells
 
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2022
Journal Article
Titel

FoilMet®-Interconnect: Busbarless, electrically conductive adhesive-free, and solder-free aluminum interconnection for modules with shingled solar cells

Alternative
FoilMet®-Interconnect: Busbarless, ECA- and Solder-Free Aluminum Interconnection for Shingled Modules
Abstract
The investigation of novel cell-to-cell interconnection methods has gained importance with the increase of wafer sizes. Shingling (i.e., overlapping) of solar cells is not only a solution for the interconnection of smaller solar cells but also a chance to increase the output power density by (i) increasing the active cell area within the module, (ii) decreasing shading losses, and (iii) reducing electrical interconnection losses. Replacing the commonly used expensive materials such as the silver in the cell's electrodes and the electrically conductive adhesive increases the attractiveness of a shingled interconnection. This article introduces the FoilMet®-Interconnect, an approach using laser-welded aluminum foil, for shingling and presents two solutions for configuration. With the production of aluminum foil-based shingle strings and modules, saving 36.7% of silver, a proof of concept was successful. In subsequent measurements, an efficiency of ηFoilMet = (21.0 ± 0.2)% was achieved with foil-based strings of three shingled cell. Temperature cycle tests after encapsulation indicate the applicability and durability of the approach.
Author(s)
Paschen, Jan
Fraunhofer-Institut für Solare Energiesysteme ISE
Baliozian, Puzant
Fraunhofer-Institut für Solare Energiesysteme ISE
John, Oliver
Fraunhofer-Institut für Solare Energiesysteme ISE
Lohmüller, Elmar orcid-logo
Fraunhofer-Institut für Solare Energiesysteme ISE
Rößler, Torsten
Fraunhofer-Institut für Solare Energiesysteme ISE
Nekarda, Jan
Fraunhofer-Institut für Solare Energiesysteme ISE
Zeitschrift
Progress in Photovoltaics
DOI
10.1002/pip.3470
10.24406/h-270544
File(s)
Progress in Photovoltaics - 2021 - Paschen - FoilMet Interconnect Busbarless electrically conductive adhesive free and.pdf (14.57 MB)
Language
English
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