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Fine-Pitch 3D Stacking Technologies for High-performance Heterogeneous Integration and Chiplet-based Architectures
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2021
Book Article
Title
Fine-Pitch 3D Stacking Technologies for High-performance Heterogeneous Integration and Chiplet-based Architectures
Author(s)
Ramm, Peter
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Badaroglu, Mustafa
Qualcomm
Franzon, Paul
North Carolina State University
Garrou, Phil
MCNC
Vivet, Pascal
CEA
Mainwork
3D InCites Yearbook 2021
Link
Link
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Keyword(s)
3D integration
3DIC
Fine-Pitch 3D Stacking
heterogeneous integration
chiplet
