2021
Journal Article
Title

Heterogeneous integration and chiplet assembly - all between 2D and 3D

Author(s)
Ramm, Peter  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Franzon, Paul
NCSU
Garrou, Philip
MCNC
Swaminathan, Raja
AMD
Vivet, Pascal
CEA
Badaroglu, Mustafa
Qualcomm
Journal
Link
Language
English
Keyword(s)