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Heterogeneous integration and chiplet assembly - all between 2D and 3D
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2021
Journal Article
Titel
Heterogeneous integration and chiplet assembly - all between 2D and 3D
Author(s)
Ramm, Peter
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Franzon, Paul
NCSU
Garrou, Philip
MCNC
Swaminathan, Raja
AMD
Vivet, Pascal
CEA
Badaroglu, Mustafa
Qualcomm
Zeitschrift
IEEE Electronics Packaging Society Newsletter
Externer Link
Externer Link
Language
English
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Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Tags
heterogeneous integration
3DIC
3D integration
chiplet
3D stacking
sensor integration
interposer