Plating for Passivated-Contact Solar Cells

Kluska, Sven; Hatt, Thibaud; Grübel, Benjamin; Cimiotti, Gisela; Schmiga, Christian; Arya, Varun; Steinhauser, Bernd; Feldmann, Frank; Bartsch, Jonas; Goraya, Baljeet Singh; Nold, Sebastian; Brand, Andreas A.; Nekarda, Jan F.; Glatthaar, Markus; Glunz, Stefan W.

2020

Journal Article

Abstract

Passivated-contact solar cell designs, such as TOPCon or silicon heterojunction solar cells (SHJs), enable cell efficiencies greater than 24%, and are promising candidates for the next revolution in mass production after the passivated emitter and rear cell (PERC). Plated metallization (Ni/Cu/Ag or Cu/Ag) fits well with new constraints on low-temperature processing and the combination of low material costs and highly conductive bifacial metal grids for these types of solar cell.